How does reactive ion etching work

Gases are introduced into the chamber and then activated by RF or microwave power to create a plasma consisting of a wide variety of reactive species, ions, and electrons.

The reactive species are chosen for their ability to react chemically with the material being etched. A negative DC bias is induced at the substrate by the free electrons which accelerates the ions towards the sample surface. The energy imparted by these ions reaching the surface greatly enhances the effectiveness of the chemical reaction and provides directionality to the etch.

Generally some form of passivating component is incorporated such that the etch proceeds only where energetic ions strike the surface. Many of the same parameters used in plasma etching apply to RIE, including pressure, gas composition, and generator power. Of particular importance is the plasma generation method commonly a parallel plate or ICP configuration , as they have different advantages depending on the material being etched.

A critical parameter specific to RIE is the DC bias applied to the sample, which directly affects the physicality of the etch. Many materials e. SiO 2 require high activation energy to react with the gases in the reactor. Other materials silicon , in particular may be etched using a passivating component which must be removed on the surface being etched.

Still other materials have little to no reactivity and must be physically removed from the surface. In most reactors, DC bias is not controlled directly, but will depend on the conductance of the plasma and the power applied to the sample. Reactive ion etching. Main article: P RIE. Main article: LAM From scientific research to manufacturing and everything in between, we have an ideal solution.

Follow us on:. Reactive Ion Etching System. Plasma Cleaning Cleaning removes all organic contamination. Learn which gases are used for the cleaning process. Vacuum Plasma All of our systems are built around the long lasting effects of vacuum plasma. Plasma Bonding Create the strongest bond possible between two dissimilar materials.

Plasma Activation Activate a surface with plasma for better printing or bonding. A single RF plasma source determines both ion density and energy.

Our RIE modules deliver anisotropic dry etching for an extensive range of processes. Read the case study to learn more. Read the full Case Study. Part of the Oxford Instruments Group Expand. Oxford Instruments. Investors Careers. Plasma deposition.